Description

KF432C16BBK2/16 is a kit of two 1G x 64-bit (8GB) DDR4-3200 CL16 SDRAM (Synchronous DRAM) 1Rx8, memory module, based on eight 1G x 8-bit FBGA components per module. Each module kit supports Intel® Extreme Memory Profiles (Intel® XMP) 2.0. Total kit capacity is 16GB. Each module has been tested to run at DDR4-3200 at a low latency timing of 16-18-18 at 1.35V. The SPDs are programmed to JEDEC standard latency DDR4-2400 timing of 17-17-17 at 1.2V. Each 288-pin DIMM uses gold contact fingers.

SPECIFICATIONS

CL(IDD) – 17 cycles

Row Cycle Time (tRCmin) – 45.75ns(min.)

Refresh to Active/Refresh; Command Time (tRFCmin) – 350ns(min.)

Row Active Time (tRASmin) – 32ns(min.)

UL Rating – 94 V – 0

Operating Temperature – 0°C to +70°C

Storage Temperature – -55°C to +100°C

FEATURES

• Power Supply: VDD = 1.2V Typical

• VDDQ = 1.2V Typical

• VPP = 2.5V Typical

• VDDSPD = 2.2V to 3.6V

• On-Die termination (ODT)

• 16 internal banks; 4 groups of 4 banks each

• Bi-Directional Differential Data Strobe

• 8 bit pre-fetch

• Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)

• Height 1.34” (34mm), w/heatsink