Description

TG-G1.5-01

Heatsink thermal paste grease

Keep your computer’s CPU cool

Practical syringe for easy application

Features

Thermal compund (grease) for heatsinks

Helps the heat dissipation from a CPU, chipset or processor to a heatsink

Excellent thermal impedance

Perfect stability – will not separate, run, migrate, or bleed

Non capacitive or electrically conductive

Specifications

Weight: 1.5 g

Color: grey

Thermal conductivity: > 4.5 W / mK

Thermal Impedance <0.205 ° C-in2 / W Density: > 2.5

Evaporation: <0.001 % Volatility: <0.005 % The dielectric constant: > 5.1

Dissipation Factor: <0.005 Viscosity: 76 CPS Thixotropic index: 310 ± 10 ° C Operating Temperature: -50 ~ 240 ° C Composites: 50% silicone compounds Compounds: 30% of carbon The compounds of metal oxides: 20%