Description

Thermal silicone compound (grease) for heatsinks

Helps the heat dissipation from a CPU, chipset or processor to a heatsink

Excellent thermal impedance

Perfect stability – will not separate, run, migrate, or bleed

Non capacitive or electrically conductive

Net weight: 15 g (23 g in the bottle)

Dimensions: 30 (diameter) x 35 mm

Color: grey

Thermal conductivity: > 4.63 W / mK

Thermal Impedance <0.0087 ° C-in2 / W Weight loss after 96 hours @ 100 °C: <0.15 % Permittivity @ 106 Hz: 2.4 Volume Resistivity: 5.0 x 10E13 (Ohm*cm) Dielectric Strength: 2.5 KV/mm Operating Temperature: -30 ~ 280 ° C Density: > 3.15 g/ cm3

Volatility: <0.15 % @100 ° The dielectric constant: > 2.4

Dissipation Factor: <0.005 Viscosity: 12500 Pa s Thixotropic index: 350 ± 10 1/10mm Composites: 15% silicone compounds Compounds: 35% of carbon The compounds of metal oxides: 50%