Description

Product information “TG Putty – Advance”

TG Putty is an electrically non-conductive alternative to conventional thermal pads. As an easy-to-apply and flexible gap filler, it compensates for height differences, making it ideal as a replacement for thermal pads on GPUs. Graphics cards typically feature several types of thermal pads of varying thicknesses from the factory, requiring different pads during replacement or when converting the cooler to a GPU water cooler.

TG Putty can be applied using the included spatulas or by hand (gloves recommended). The spatula allows for broad application, while by hand, it can be shaped into small pellets tailored to the surface size (e.g., VRAM, SMD). TG Putty can fill height differences ranging from 0.2 to 3.0 mm.

TG Putty is available in three variants, primarily differing in their thermal conductivity:

TG Putty Basic: Medium thermal conductivity

TG Putty Advance: Good thermal conductivity

TG Putty Pro: Excellent thermal conductivity

For modifying a single, smaller graphics card without an active backplate (e.g., GeForce GTX 1060), approximately one 30-gram container of TG Putty is required. For larger graphics cards, such as a GeForce RTX 4090, one 30-gram container is generally sufficient for the memory (VRAM) and voltage regulators (VRM) on the front side. On the backside, there is often a uniform, larger gap between the PCB and the backplate on larger graphics cards. In this case, approximately two 30-gram containers are needed to completely fill this gap.

Notes:

TG Putty is not suitable for use on processors (IHS or Direct Die) or directly on the GPU die!

Before application, the target surface should be thoroughly cleaned and degreased, for example, using TG Cleaning Wipes or conventional isopropanol.

Scope of Delivery

Thermal Putty Advanced

3x Spatulas